These demos present an in-depth view of various manufacturing
products relative to packaging. Scroll down to view all
demos or select a vendor name from either menu.
PakSi-TM’s Direct CAD Interface (DCI) Capabilities
PakSi-TM’s Direct CAD Interface (DCI) Capabilities is
an expert system to predict solder joint fatigue life
of IC packages. PakSi-SJF is a full featured package
modeling tool, with user- friendly GUI that helps users
easily set up complex thermal cycling information and
creep strain rate properties, to predict solder joint
life automatically. PakSi-SJF makes solder joint reliability
analysis easy for all the designers.
PakSi-TM
PakSi-TM will help in the most detailed thermal/mechanical
modeling of the most advanced packages within minutes.
It can cut your package modeling and analysis time significantly.
Using the Optimal Corp's proprietary solver algorithm,
PakSi-TM is an extremely efficient tool. You can start
using this tool within an hour, without any formal training.
