|
|
|
|
 |
Founded in 1995, Optimal is a leading provider of high signal integrity electronic design automation
software. The company's breakthrough technology and engineering expertise have helped leading
chip and system companies solve challenging high-speed design problems and bring industry-leading products
to market.
Optimal provides customers with a complete signal integrity design flow from IC to package to PCB.
The core technology includes superior numerical techniques, efficient CAD database manipulation
and unique signal integrity solution. The products are designed for both junior and senior engineers
working on interconnect extraction, IR drop, crosstalk, and ground bounce analysis. |
|
|
|
|
| |
|
|
|
 |
|
| |
| Category:
Manufacturing-Packaging |
|
|
|
PakSi-TM’s Direct CAD Interface (DCI) Capabilities is an expert
system to predict solder joint fatigue life of IC packages. PakSi-SJF is a full featured
package modeling tool, with user- friendly GUI that helps users easily set up complex
thermal cycling information and creep strain rate properties, to predict solder joint
life automatically. PakSi-SJF makes solder joint reliability analysis easy for all
the designers. |
| |
| |
|
| Category:
Manufacturing-Packaging |
|
|
|
PakSi-TM will help in the most detailed thermal/mechanical
modeling of the most advanced packages within minutes. It can cut your package modeling
and analysis time significantly. Using the Optimal Corp's proprietary solver algorithm,
PakSi-TM is an extremely efficient tool. You can start using this tool within an
hour, without any formal training. |
| |
| |
|
| Category:
Back End-Post Layout Checks |
|
|
|
SIDEA™ (Signal Integrity Design Assistants) is a complete
suite of signal integrity design assistants for parasitic extraction and S-parameter
conversion, manipulation and modeling. SIDEA was developed to put most-often used signal
integrity design tools in one place so engineers need not mix and match software from various
sources. |
| |
|
|
|
|
|
 |
|
8/11/2004 - Optimal
Optimal and AWR to Offer First 3D Full-Wave Electromagnetic Extraction Capability for Microwave and RFIC Designs | 6/7/2004 - Optimal
Optimal Products Selected by TSMC for Integrated Chip-to-Package Co-Design in TSMC Reference Flow 5.0 |
|
|
|
|
|
|
|
