Common Platform alliance members, Chartered, IBM and Samsung, jointly hosted the first-ever Common Platform Technology Forum. Based on the popular day-long format that Chartered has presented for many years, the event provided access to executives, technologists, roadmaps and strategies from all three alliance members, plus their technology development partners. With a theme of "Accelerating the Future: Optimizing Silicon through Collaboration," the event focused on how the power of collaboration can help designers develop leading-edge electronic products.
  The Innovation Equation
Presentation by Adalio Sanchez, IBM

Executive Panel - The Business of Collaboration
Moderator: Adalio Sanchez, IBM
Panelists: Chia Song Hwee, Chartered
 Aart de Geus, Synopsys
 O. H. Kwon, Samsung
 Michael Cadigan, IBM
 Bill McKean, Freescale
 Philippe Magarshack, STMicroelectronics

  Optimizing Silicon Technology Through Innovation and Collaboration
Presentation by Gary Patton, IBM

  Addressing Advanced Technology Design
Introduction by Walt Lange, Chartered
Presentations by Mark Johnstone, Freescale and
Philippe Magarshack, STMicroelectronics

  DFM for Common Platform Technology
Introduction by Walter Ng, Chartered
Presentations by K. M. Choi, Samsung and Lars Liebmann, IBM

  The Future: Devices, Interconnect and Computational Lithography
Presentations by Subramanian Iyer, Dan Edelstein and Dario Gil, IBM

  Advanced Packaging Challenges
Introduction by Daniel Armbrust, IBM
Presentations by Mike Barrow, Lee Smith and Jon Aday, Amkor

  Common Platform Process Technology and Enablement
Introduction by Walter Ng, Chartered
Presentations by Mike Muller and Tom Lantzsch, ARM

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