These demos present an in-depth view of various manufacturing products relative to packaging. Scroll down to view all demos or select a vendor name from either menu.
PakSi-TM’s Direct CAD Interface (DCI) Capabilities
PakSi-TM’s Direct CAD Interface (DCI) Capabilities is an expert system to predict solder joint fatigue life of IC packages. PakSi-SJF is a full featured package modeling tool, with user- friendly GUI that helps users easily set up complex thermal cycling information and creep strain rate properties, to predict solder joint life automatically. PakSi-SJF makes solder joint reliability analysis easy for all the designers.

PakSi-TM will help in the most detailed thermal/mechanical modeling of the most advanced packages within minutes. It can cut your package modeling and analysis time significantly. Using the Optimal Corp's proprietary solver algorithm, PakSi-TM is an extremely efficient tool. You can start using this tool within an hour, without any formal training.

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